GlossaryThere are 160 entries in this glossary.
The average time interval between a storage peripheral (usually a disk drive or semiconductor memory) receiving a request to read or write a certain location and returning the value read or completing the write.
|Advanced Graphics Port||
The advanced graphics port (AGP) bus allows the graphics controller to directly access texture map data from the main memory rather than having to move it to the graphic controllers' local memory first. This helps the system increase the speed of processing graphics and allows for a use of a larger portion of memory by "borrowing" storage for texture maps from main memory.
|Ball Grid Array||
A type of memory chip with solder balls on the underside for mounting. Use of BGA allows die package size to be reduced because there is more surface area for attachment. Smaller packaging allows more components to be mounted on a module, making greater densities available. The smaller package also improves heat dissipation for better performance. See CSP and FBGA.
A measure of the capacity of data that can be moved between two points in a given period of time
1. A slot or group of slots that must be populated with modules of like capacity in order to fulfill the data width requirement of the CPU 2. A segment of memory on a module, sometimes also referred to as a row. Modules are either single or dual banked 3. An internal logic segment in a memory component. For example, a 64Mb SDRAM has 4 banks.
See Ball Grid Array
|Bill of Materials||
Build of Materials (BOM); list of raw materials, sub assemblies, intermediate assemblies, sub-components, components.
Numbering system based on two digits: 0 and 1.
Basic input/output system. Often referred to as CMOS, the BIOS provides an interface for a computer's hardware and software. The BIOS configuration determines how your hardware is accessed.
Binary digit. The smallest piece of data (a 1 or a 0) that a computer recognizes.