GlossaryThere are 16 entries in this glossary.
|Ball Grid Array||
A type of memory chip with solder balls on the underside for mounting. Use of BGA allows die package size to be reduced because there is more surface area for attachment. Smaller packaging allows more components to be mounted on a module, making greater densities available. The smaller package also improves heat dissipation for better performance. See CSP and FBGA.
A measure of the capacity of data that can be moved between two points in a given period of time
1. A slot or group of slots that must be populated with modules of like capacity in order to fulfill the data width requirement of the CPU 2. A segment of memory on a module, sometimes also referred to as a row. Modules are either single or dual banked 3. An internal logic segment in a memory component. For example, a 64Mb SDRAM has 4 banks.
See Ball Grid Array
|Bill of Materials||
Build of Materials (BOM); list of raw materials, sub assemblies, intermediate assemblies, sub-components, components.
Numbering system based on two digits: 0 and 1.
Basic input/output system. Often referred to as CMOS, the BIOS provides an interface for a computer's hardware and software. The BIOS configuration determines how your hardware is accessed.
Binary digit. The smallest piece of data (a 1 or a 0) that a computer recognizes.
A circuit or system drawing concerned with major functions and interconnections between functions.
The process of exercising an integrated circuit at elevated voltage and temperature. This process accelerates failures normally seen as "infant mortality" in a chip. (Those chips that would fail early during actual usage will fail during burn-in. Those that pass have a life expectancy much greater than that required for normal usage.)
Circuitry that is used to move data