GlossaryThere are 20 entries in this glossary.
An element, such as silicon, that is intermediate in electrical conductivity between conductors and insulators, through which conduction takes place by means of holes and electrons.
|Serial Presence Detect||
An EEPROM on certain memory modules used to store and provide information to the system using the module.
A reduction in die (chip) size. A reduction in the size of the circuit design resulting in smaller die sizes that increases the number of possible die per wafer.
Single inline memory module. A high-density DRAM package alternative consisting of several components connected to a single printed circuit board.
Single layer Cell. Great for high performance, lower power consumption and fast write speeds.
Small outline J-lead package. A rectangular package with leads sticking out of the side of the package. The leads are formed in a J-bend profile, bending underneath and towards the bottom of the package.
Small outline Rambus inline memory module. SORIMMs have a smaller profile that standard RIMMs and are used in laptop computers and systems that have strict size requirements.