OEM & System Builder

DDR Memory Modules

Multiple Form Factors

UDIMM, RDIMM & SODIMM

DDR3, DDR4 & DDR5

JEDEC-standard DDR generations

ECC & Non-ECC

Registered & unbuffered options

Industry Applications

Servers, workstations, industrial PCs & embedded systems

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Memory Modules

Centon DDR memory modules pair JEDEC-standard DDR DRAM with rigorously qualified components on a controlled bill of materials. Available in unbuffered (UDIMM), registered (RDIMM), and small-outline (SODIMM) form factors across DDR3, DDR4, and DDR5, in ECC and non-ECC configurations for server, workstation, industrial-PC, and embedded designs — backed by SPD customization, post-production testing, and long-lifecycle supply for OEM and system-builder programs.

Item No. Tech Interface Control ECC Speed CL Size Temp Info
RD-BC5CS7RCE100-01 DDR5 262-pin SODIMM Unbuffered ECC PC5-44800 (5600MT/s) CL46
  • 128GB
  • 32GB
  • 64GB
0C to +95C
RD-B85SRCC1-00HF-01 DDR5 262-pin SODIMM Unbuffered Non-ECC PC5-44800 (5600MT/s) CL46
  • 128GB
  • 16GB
  • 32GB
  • 64GB
  • 8GB
0C to +95C
RD-BA5SRCA1-00HF-01 DDR5 262-pin SODIMM Unbuffered Non-ECC PC5-44800 (5600MT/s) CL46
  • 16GB
  • 32GB
  • 64GB
0C to +95C
RD-BC5CSRCB100-01 DDR5 262-pin SODIMM Unbuffered Non-ECC PC5-44800 (5600MT/s) CL46
  • 128GB
  • 32GB
  • 64GB
0C to +95C
RD-B85URCB1-00HF-01 DDR5 288-pin DIMM Unbuffered Non-ECC PC5-44800 (5600MT/s) CL46
  • 16GB
  • 32GB
0C to +95C
RD-BA4S7RCG1HF070-03 DDR4 260-pin SODIMM Unbuffered ECC PC4-25600 (3200MT/s) CL22
  • 16GB
  • 32GB
0C to +95C
RD-BA4S8F4100HF-32 DDR4 260-pin SODIMM Unbuffered Non-ECC PC4-25600 (3200MT/s) CL22
  • 16GB
  • 32GB
0C to +95C
RD-B84URCA2210-04 DDR4 288-pin DIMM Unbuffered Non-ECC PC4-21300 (2666MT/s) CL19
  • 4GB
  • 8GB
0C to +95C
RD-B84URCA2210-06 DDR4 288-pin DIMM Unbuffered Non-ECC PC4-25600 (3200MT/s) CL22
  • 16GB
  • 32GB
  • 8GB
0C to +95C
RD-BA4RRCE2HF050-02 DDR4 288-pin RDIMM Registered ECC-Parity PC4-23400 (2933MT/s) CL21
  • 16GB
  • 32GB
0C to +95C
RD-B84RRCD1HF100-03 DDR4 288-pin RDIMM Registered ECC-Parity PC4-25600 (3200MT/s) CL22
  • 16GB
  • 8GB
0C to +95C
RD-BA4RRCE3070-01 DDR4 288-pin RDIMM Registered ECC-Parity PC4-25600 (3200MT/s) CL22
  • 16GB
  • 32GB
0C to +95C
RDB83SRCF-1-10F3G06 DDR3 204-pin SODIMM Unbuffered Non-ECC PC3-10600 (1333MT/s) CL9
  • 8GB
0C to +95C
1GBPC3200 DDR SODIMM 184-pin DIMM Unbuffered Non-ECC PC3200 (400MHz)
S1-D4S240016G 260-pin SODIMM
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About the Technology

About DRAM memory modules
Centon DRAM memory modules pair JEDEC-standard DDR DRAM with rigorously qualified components on a controlled bill of materials. Available in unbuffered (UDIMM), registered (RDIMM), and small-outline (SODIMM) form factors across DDR3, DDR4, and DDR5 generations, in ECC and non-ECC configurations to match server, workstation, industrial-PC, and embedded designs. Every build is locked to a fixed BOM with a new part number on any change, backed by SPD customization, post-production testing, and long-lifecycle supply for OEM and system-builder programs.
ECC vs. non-ECC and registered memory
ECC (error-correcting code) modules add an extra DRAM device that lets the memory controller detect and correct single-bit errors on the fly — important for servers and any system where silent data corruption is unacceptable. Non-ECC modules omit that device and are typical in desktops and many embedded designs. Registered (buffered) memory — RDIMMs — places a register between the controller and the DRAM to reduce electrical load, allowing more modules and higher total density per channel; unbuffered memory (UDIMM and SODIMM) connects the controller directly for lower latency in smaller configurations. Your CPU and chipset dictate which type is supported, so the module must match the platform.
DDR3, DDR4 and DDR5 generations
DDR (Double Data Rate) DRAM advances by generation — DDR3, DDR4, and DDR5. Each generation lowers operating voltage, raises bandwidth, and changes the physical key/notch, so modules are not cross-compatible between sockets: a board designed for one generation accepts only that generation. DDR5 also moves power management onto the module and splits each module into independent sub-channels. Choose the generation your CPU and motherboard support; the spec table on this page lists the generation, form factor, and pin count for each part.
Designing in: what engineers should check
When qualifying a module into a design, engineers typically confirm more than density: the JEDEC raw-card revision and DRAM organization, the SPD timing profile (which Centon can customize for your platform), module height and form factor for mechanical clearance, ECC and registered support on the target chipset, the operating temperature grade, and component-level BOM control so the module you qualify is the module you receive for the life of the program. Centon assigns a new part number on any BOM change and offers post-production burn-in and application validation, so a qualified build stays fixed.

SERVICE BACKED SOLUTIONS

Quality products at affordable prices, engineered specifically for your needs, are just the beginning. We add value through inventory management, controlled bill of materials, and personalized service.
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