OEM & System Builder

eMMC 5.1 Embedded Flash Modules

Multiple Form Factors

eMMC 5.1, 5.0 standards, 150 & 153 ball package

Extended Temperature

Commercial -25°C to 85°C
Industrial -25°C to 85°C
Automotive -40°C to 105°C

Wide Capacity Range

4GB to 256GB across MLC, pSLC & 3D TLC

Industry Applications

Portable devices, IoT, automotive infotainment, industrial PCs & smart home

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Item No. Interface Form Factor Operating Temp Capacity NAND Type Seq. Read (MB/s) Seq. Write (MB/s) Info
E5-100AM-16G eMMC 5.1 HS400 100-ball BGA Automotive -40 to 105 C
  • 16GB
 MLC 320 125
E5-100AM-8G eMMC 5.1 HS400 100-ball BGA Automotive -40 to 105 C
  • 8GB
 MLC 260 100
E5-100AP-4G eMMC 5.1 HS400 100-ball BGA Automotive -40 to 105 C
  • 4GB
 pSLC 260 100
E5-100IM-16G eMMC 5.1 HS400 100-ball BGA Industrial -40 to 85 C
  • 16GB
 MLC 320 125
E5-100IM-8G eMMC 5.1 HS400 100-ball BGA Industrial -40 to 85 C
  • 8GB
 MLC 260 100
E5-100IP-4G eMMC 5.1 HS400 100-ball BGA Industrial -40 to 85 C
  • 4GB
 pSLC 260 100
E5-153AT1-128G eMMC 5.1 HS400 153-ball BGA Automotive -40 to 105 C
  • 128GB
 3D TLC 280 240
E5-153AT2-128G eMMC 5.1 HS400 153-ball BGA Automotive -40 to 105 C
  • 128GB
 3D TLC 320 130
E5-153AT2-256G eMMC 5.1 HS400 153-ball BGA Automotive -40 to 105 C
  • 256GB
 3D TLC 320 130
E5-153AT1-32G eMMC 5.1 HS400 153-ball BGA Automotive -40 to 105 C
  • 32GB
 3D TLC 260 100
E5-153AT1-64G eMMC 5.1 HS400 153-ball BGA Automotive -40 to 105 C
  • 64GB
 3D TLC 260 100
E5-153AT2-64G eMMC 5.1 HS400 153-ball BGA Automotive -40 to 105 C
  • 64GB
 3D TLC 320 130
E5-153AM-16G eMMC 5.1 HS400 153-ball BGA Automotive -40 to 105 C
  • 16GB
 MLC 320 125
E5-153AM-8G eMMC 5.1 HS400 153-ball BGA Automotive -40 to 105 C
  • 8GB
 MLC 260 100
E5-153AP-4G eMMC 5.1 HS400 153-ball BGA Automotive -40 to 105 C
  • 4GB
 pSLC 260 100
E5-153CT2-128G eMMC 5.1 HS400 153-ball BGA Commercial -25 to 85 C
  • 128GB
 3D TLC 320 280
E5-153CT1-16G eMMC 5.1 HS400 153-ball BGA Commercial -25 to 85 C
  • 16GB
 3D TLC 310 110
E5-153CT2-16G eMMC 5.1 HS400 153-ball BGA Commercial -25 to 85 C
  • 16GB
 3D TLC — 109
E5-153CT2-256G eMMC 5.1 HS400 153-ball BGA Commercial -25 to 85 C
  • 256GB
 3D TLC 320 280
E5-153CT1-32G eMMC 5.1 HS400 153-ball BGA Commercial -25 to 85 C
  • 32GB
 3D TLC 310 110
E5-153CT2-32G eMMC 5.1 HS400 153-ball BGA Commercial -25 to 85 C
  • 32GB
 3D TLC 320 280
E5-153CT2-512G eMMC 5.1 HS400 153-ball BGA Commercial -25 to 85 C
  • 512GB
 3D TLC 320 280
E5-153CT2-64G eMMC 5.1 HS400 153-ball BGA Commercial -25 to 85 C
  • 64GB
 3D TLC 320 280
E5-153CT1-8G eMMC 5.1 HS400 153-ball BGA Commercial -25 to 85 C
  • 8GB
 3D TLC — —
E5-153CM-4G eMMC 5.1 HS400 153-ball BGA Commercial -25 to 85 C
  • 4GB
 MLC — —
E5-153CM-8G eMMC 5.1 HS400 153-ball BGA Commercial -25 to 85 C
  • 8GB
 MLC 280 105
E5-153IT1-128G eMMC 5.1 HS400 153-ball BGA Industrial -40 to 85 C
  • 128GB
 3D TLC 280 240
E5-153IT2-128G eMMC 5.1 HS400 153-ball BGA Industrial -40 to 85 C
  • 128GB
 3D TLC 310 130
E5-153IT2-256G eMMC 5.1 HS400 153-ball BGA Industrial -40 to 85 C
  • 256GB
 3D TLC 310 130
E5-153IT1-32G eMMC 5.1 HS400 153-ball BGA Industrial -40 to 85 C
  • 32GB
 3D TLC 260 100
E5-153IT1-64G eMMC 5.1 HS400 153-ball BGA Industrial -40 to 85 C
  • 64GB
 3D TLC 260 100
E5-153IT2-64G eMMC 5.1 HS400 153-ball BGA Industrial -40 to 85 C
  • 64GB
 3D TLC 310 130
E5-153IM-16G eMMC 5.1 HS400 153-ball BGA Industrial -40 to 85 C
  • 16GB
 MLC 320 125
E5-153IM-8G eMMC 5.1 HS400 153-ball BGA Industrial -40 to 85 C
  • 8GB
 MLC 260 100
E5-153IP-4G eMMC 5.1 HS400 153-ball BGA Industrial -40 to 85 C
  • 4GB
 pSLC 260 100
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About the Technology

About eMMC
Centon eMMC 5.1 embedded flash modules integrate NAND and a managed controller in a single soldered-down BGA package — compact, low-power, non-removable storage for embedded designs. Available in 100- and 153-ball BGA, 4GB to 256GB, in commercial, industrial, and automotive temperature grades (-40°C to 105°C), with MLC, pSLC, and 3D TLC NAND to match your endurance and cost targets.
Managed NAND simplifies your design
Unlike raw NAND, eMMC builds the flash controller into the package, so it handles ECC, wear leveling, and bad-block management for you. You get a standardized JEDEC interface, a faster design-in, and no need to develop or maintain flash-management firmware on the host processor.
How eMMC compares to UFS and SSDs
eMMC uses a half-duplex parallel interface (up to ~400 MB/s on HS400) and is ideal for cost- and space-sensitive designs that boot and run from a single soldered package. UFS adds higher, full-duplex throughput for performance-critical systems, while SSDs suit removable, high-capacity storage. For most embedded and IoT workloads, eMMC strikes the right balance of cost, footprint, and reliability.
Built for industrial and automotive use
Centon eMMC is offered in commercial, industrial (-40°C to 85°C), and automotive (-40°C to 105°C) temperature grades, with pSLC options for write-intensive workloads. Paired with controlled bills of materials and long-lifecycle supply, it suits designs that must stay in production for years.

How to select the right NAND solution?

Capacity

How much data do you need to store? Bits per cell determines density per chip. Higher density NAND fits more storage in the same package, which matters in space constrained BGA designs. pSLC sacrifices half its physical capacity to gain endurance.

Endurance

How many write cycles the flash can absorb before wearing out. Driven by your workload's write intensity, a device that logs sensor data every second has a fundamentally different endurance requirement than one that boots, runs, and is rarely written to.

Cost

Cost per gigabyte tracks closely with density. 3D TLC is the lowest-cost option per gigabyte; pSLC is the highest. The right answer is rarely "the cheapest" or "the most durable"; it's the one that meets your endurance target without overspending on margin you won't use.

SERVICE BACKED SOLUTIONS

Quality products at affordable prices, engineered specifically for your needs, are just the beginning. We add value through inventory management, controlled bill of materials, and personalized service.
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