Product Details
| Item No. | E5-100AP-4G |
| Interface | eMMC 5.1 HS400 |
| Form Factor | 100-ball BGA |
| Operating Temperature | Automotive Grade 2: -40 to +105C |
| Size | 4GB |
| Sequential Write (MB/s) | 100 |
| Sequential Read (MB/s) | 260 |
| Voltage | 3.3V |
| I/O Voltage (VCCQ) | 3.3V/1.8V |
| W/E Endurance | ≥ 30K |
| Package Size | 14.0 x 18 x 1.4 mm |
| Data Retention | 1-Year @ life-end | 10-Years @ initial |
Similar parts
View all →| Part number | Package | Temperature | Capacity | NAND |
|---|---|---|---|---|
| E5-100AM-8G | 100-ball BGA | Automotive -40°C to 105°C | 8GB | MLC |
| E5-100AM-16G | 100-ball BGA | Automotive -40°C to 105°C | 16GB | MLC |
| E5-153AP-4G | 153-ball BGA | Automotive -40°C to 105°C | 4GB | pSLC |
| E5-153AM-8G | 153-ball BGA | Automotive -40°C to 105°C | 8GB | MLC |
| E5-153AM-16G | 153-ball BGA | Automotive -40°C to 105°C | 16GB | MLC |
| E5-153AT1-32G | 153-ball BGA | Automotive -40°C to 105°C | 32GB | 3D TLC (64-Layer) |
| E5-153AT1-64G | 153-ball BGA | Automotive -40°C to 105°C | 64GB | 3D TLC (64-Layer) |
| E5-153AT1-128G | 153-ball BGA | Automotive -40°C to 105°C | 128GB | 3D TLC (64-Layer) |
| E5-153AT2-64G | 153-ball BGA | Automotive -40°C to 105°C | 64GB | 3D TLC (112-Layer) |
| E5-153AT2-128G | 153-ball BGA | Automotive -40°C to 105°C | 128GB | 3D TLC (112-Layer) |
| E5-153AT2-256G | 153-ball BGA | Automotive -40°C to 105°C | 256GB | 3D TLC (112-Layer) |
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