Product Details
| Item No. | E5-153CT2-16G |
| Interface | eMMC 5.1 HS400 |
| Form Factor | 153-ball BGA |
| Operating Temperature | Extended: -25 to +85C |
| Size | 16GB |
| Sequential Write (MB/s) | 109 |
| Voltage | 3.3V |
| I/O Voltage (VCCQ) | 3.3V/1.8V |
| W/E Endurance | ≥ 3K |
| Package Size | 11.5 × 13.0 × 1.0 mm |
| Data Retention | 1-Year @ life-end | 10-Years @ initial |
Similar parts
View all →| Part number | Package | Temperature | Capacity | NAND |
|---|---|---|---|---|
| E5-153CM-4G | 153-ball BGA | Commercial -25°C to 85°C | 4GB | MLC |
| E5-153CM-8G | 153-ball BGA | Commercial -25°C to 85°C | 8GB | MLC |
| E5-153CT1-8G | 153-ball BGA | Commercial -25°C to 85°C | 8GB | 3D TLC (64-Layer) |
| E5-153CT1-16G | 153-ball BGA | Commercial -25°C to 85°C | 16GB | 3D TLC (64-Layer) |
| E5-153CT1-32G | 153-ball BGA | Commercial -25°C to 85°C | 32GB | 3D TLC (64-Layer) |
| E5-153CT2-32G | 153-ball BGA | Commercial -25°C to 85°C | 32GB | 3D TLC (112-Layer) |
| E5-153CT2-64G | 153-ball BGA | Commercial -25°C to 85°C | 64GB | 3D TLC (176-Layer) |
| E5-153CT2-128G | 153-ball BGA | Commercial -25°C to 85°C | 128GB | 3D TLC (176-Layer) |
| E5-153CT2-256G | 153-ball BGA | Commercial -25°C to 85°C | 256GB | 3D TLC (176-Layer) |
| E5-153CT2-512G | 153-ball BGA | Commercial -25°C to 85°C | 512GB | 3D TLC (176-Layer) |
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