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Up to 512GB

High-Capacity eMMC 5.1

The most capacity per chip for indoor embedded and consumer devices, -25°C to 85°C.

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Other temperature grades

Automotive eMMC-40°C to 105°C
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Industrial eMMC-40°C to 85°C
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Standard · Commercial

-25°C to 85°C

  • 4GB to 512GB
  • 153-ball BGA
  • MLC, 3D TLC

Find your part

Filter by package, capacity and NAND type.

Item No. Interface Form Factor Operating Temp Capacity NAND Type Seq. Read (MB/s) Seq. Write (MB/s) Info
E5-153CT2-128G eMMC 5.1 HS400 153-ball BGA Commercial -25°C to 85°C
  • 128GB
 3D TLC 320 280
E5-153CT1-16G eMMC 5.1 HS400 153-ball BGA Commercial -25°C to 85°C
  • 16GB
 3D TLC 310 110
E5-153CT2-16G eMMC 5.1 HS400 153-ball BGA Commercial -25°C to 85°C
  • 16GB
 3D TLC — 109
E5-153CT2-256G eMMC 5.1 HS400 153-ball BGA Commercial -25°C to 85°C
  • 256GB
 3D TLC 320 280
E5-153CT1-32G eMMC 5.1 HS400 153-ball BGA Commercial -25°C to 85°C
  • 32GB
 3D TLC 310 110
E5-153CT2-32G eMMC 5.1 HS400 153-ball BGA Commercial -25°C to 85°C
  • 32GB
 3D TLC 320 280
E5-153CT2-512G eMMC 5.1 HS400 153-ball BGA Commercial -25°C to 85°C
  • 512GB
 3D TLC 320 280
E5-153CT2-64G eMMC 5.1 HS400 153-ball BGA Commercial -25°C to 85°C
  • 64GB
 3D TLC 320 280
E5-153CT1-8G eMMC 5.1 HS400 153-ball BGA Commercial -25°C to 85°C
  • 8GB
 3D TLC — —
E5-153CM-4G eMMC 5.1 HS400 153-ball BGA Commercial -25°C to 85°C
  • 4GB
 MLC — —
E5-153CM-8G eMMC 5.1 HS400 153-ball BGA Commercial -25°C to 85°C
  • 8GB
 MLC 280 105
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About the Technology

About this grade
Centon commercial grade eMMC 5.1 gives you the most storage in a single BGA package: up to 512GB in 153-ball BGA using 176-layer 3D TLC NAND. Rated -25°C to 85°C (extended commercial), it suits indoor embedded systems, consumer devices and gateways that need high capacity at the lowest cost per gigabyte. MLC options at 4GB and 8GB cover boot and firmware storage.
What is the largest eMMC you offer?
512GB, in 153-ball BGA with 176-layer 3D TLC NAND.
What does commercial (extended) grade mean?
It is rated from -25°C to 85°C, wider than standard 0°C to 70°C consumer parts. For outdoor or unheated designs, choose Industrial (-40°C to 85°C).
Why 3D TLC for high capacity?
3D TLC stores three bits per cell in stacked layers, giving the most capacity and the lowest cost per gigabyte. It suits read-heavy storage such as media, maps and application data.

How to select the right NAND solution?

Capacity

How much data do you need to store? Bits per cell determines density per chip. Higher density NAND fits more storage in the same package, which matters in space constrained BGA designs. pSLC sacrifices half its physical capacity to gain endurance.

Endurance

How many write cycles the flash can absorb before wearing out. Driven by your workload's write intensity, a device that logs sensor data every second has a fundamentally different endurance requirement than one that boots, runs, and is rarely written to.

Cost

Cost per gigabyte tracks closely with density. 3D TLC is the lowest-cost option per gigabyte; pSLC is the highest. The right answer is rarely "the cheapest" or "the most durable"; it's the one that meets your endurance target without overspending on margin you won't use.

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