Centon, 153-ball BGA (Extended), 3D TLC (176-Layer), 256GB
Centon, 153-ball BGA (Extended), 3D TLC (176-Layer), 256GB
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Centon, 153-ball BGA (Extended), 3D TLC (176-Layer), 256GB

Product Details
JEDEC eMMC 5.1 compliant. Single-package managed NAND: MLC die + integrated controller behind a
standard eMMC interface. On-controller flash management includes ECC, wear-leveling, IOPS optimization,
and read sensing, isolating the host from NAND-level complexity and reliability handling. Suitable as a
universal embedded storage component for systems requiring standardized, host-transparent non-volatile
storage.

Item No. E5-153CT2-256G
Interface eMMC 5.1 HS400
Form Factor 153-ball BGA
Operating Temperature Extended: -25 to +85C
Size 256GB
Sequential Write (MB/s) 280
Sequential Read (MB/s) 320
Voltage 3.3V
I/O Voltage (VCCQ) 1.8V/3.3V
W/E Endurance ≥ 3K
Package Size 11.5 × 13.0 × 1.0 mm
Data Retention 1-Year @ life-end | 10-Years @ initial

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