Centon DRAM memory modules pair JEDEC-standard DDR DRAM with rigorously qualified components on a controlled bill of materials. Available in unbuffered (UDIMM), registered (RDIMM), and small-outline (SODIMM) form factors across DDR3, DDR4, and DDR5 generations, in ECC and non-ECC configurations to match server, workstation, industrial-PC, and embedded designs. Every build is locked to a fixed BOM with a new part number on any change, backed by SPD customization, post-production testing, and long-lifecycle supply for OEM and system-builder programs.

ECC (error-correcting code) modules add an extra DRAM device that lets the memory controller detect and correct single-bit errors on the fly, important for servers and any system where silent data corruption is unacceptable. Non-ECC modules omit that device and are typical in desktops and many embedded designs. Registered (buffered) memory, RDIMMs, places a register between the controller and the DRAM to reduce electrical load, allowing more modules and higher total density per channel; unbuffered memory (UDIMM and SODIMM) connects the controller directly for lower latency in smaller configurations. Your CPU and chipset dictate which type is supported, so the module must match the platform.

Rank refers to how many independent sets of DRAM chips a module can address at once. A single-rank (1Rx) module presents one set of DRAM to the memory controller per access; a dual-rank (2Rx) module presents two, doubling the addressable chip select lines on the same module. Single-rank modules are simpler for the memory controller to drive and typically support higher speed grades at a given density, so they are the safer default when your platform's controller has limited rank support or you are running near the top of its supported speed. Dual-rank modules pack more capacity onto one module and let a system reach higher total memory with fewer physical slots, which matters most in servers and workstations that are capacity constrained rather than speed constrained. Check your platform's maximum supported ranks per channel and per DIMM before specifying either configuration.

DDR4 lowered operating voltage and raised bandwidth over DDR3, with a physical key and notch unique to the generation, so DDR4 modules are not backward or forward-compatible with DDR3 or DDR5 sockets. It remains the standard for a large base of servers, workstations, and embedded designs that are not moving to DDR5 on any near-term timeline. The spec table on this page lists the exact speed grade, form factor, and pin count for each part.

When qualifying a module into a design, engineers typically confirm more than density: the JEDEC raw-card revision and DRAM organization, the SPD timing profile (which Centon can customize for your platform), module height and form factor for mechanical clearance, ECC and registered support on the target chipset, the operating temperature grade, and component-level BOM control so the module you qualify is the module you receive for the life of the program. Centon assigns a new part number on any BOM change and offers post-production burn-in and application validation, so a qualified build stays fixed.